BGA Solder Balls are essential components used in ICs and precision electronics, providing both electrical and mechanical connections. As a key material in BGA (Ball Grid Array) packaging, they play a critical role in determining yield and stability. Typically made of an alloy consisting of tin (Sn), silver (Ag), and copper (Cu), with diameters ranging from 0.2mm to 0.76mm, BGA solder balls have become indispensable in modern packaging.
As IC integration, pin count, density, and layers increase, traditional lead-based packaging methods can no longer meet the demands. BGA and CSP (Chip Size Package) technologies, which utilize the bottom area of the chip for ball placement, address issues such as pin coplanarity, narrow pin spacing, and excessive package size. This advanced packaging technology is increasingly replacing traditional solder joints.
Due to their stability, ultra-low void rate, and easy process control, BGA solder balls are widely used in modern microelectronic packaging, including BGA, CSP, Flip-Chip, WLCSP (Wafer-Level CSP), MEMS, and FCBGA (Flip-Chip BGA). These solder balls are commonly found in high-integration products like mobile SoC (System on Chip) chips, wireless Bluetooth earphones, computer memory chips, and laptop CPUs and GPUs.
Key Specifications:
- Standard: 250Kpcs / 1KKpcs
- Diameter: 0.2mm to 0.76mm
- Composition: Tin (Sn), Silver (Ag), Copper (Cu) Alloy
- Application: BGA, CSP, Flip-Chip, WLCSP, MEMS, FCBGA
BGA solder balls provide a reliable connection between high-performance chips and PCB (Printed Circuit Boards), ensuring the proper transmission of electronic signals and maintaining the functionality of electronic products.
