- Protection from Mechanical Damage: The packaging shell protects the chip from external impacts, vibrations, and bending.
- Environmental Protection: It shields the chip from moisture, dust, and corrosive gases (such as sulfur compounds).
- Temperature Shock Resistance: By selecting materials with matching thermal coefficients (e.g., low CTE substrates), the packaging reduces thermal stress and protects the chip from temperature shocks.
Who We Are
Luoyang Qiacai Industrial Co., Ltd. is a National High-Tech Enterprise specializing in R&D, production, sales, and technical services. Guided by a corporate culture of Focus and Execution, the company focuses on semiconductor material development and manufacturing, aiming to accelerate the localization of essential chip materials.
With strong R&D capabilities, Luoyang Qiacai delivers comprehensive solutions to customers in the electronic packaging and assembly welding sectors, offering top-tier products and services.
Main Products: BGA Solder Balls, Copper Core Solder Balls, CCGA Solder Columns, Solder Paste, Solder Flux, Solder Preforms, Solder Mask, and more.
Product Strength Advantages
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Excellent Surface Quality
Appearance Index World No. 1
Excellent Surface Quality
Appearance Index World No. 1
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Excellent Push-Pull Strength
Higher push-pull strength and better stability.
Excellent Push-Pull Strength
Higher push-pull strength and better stability.
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HAIPU-SAC305 can suppress excessive growth of IMC.
HAIPU-SAC305 can suppress excessive growth of IMC.
our Advantage
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Physical Protection and Reliability Enhancement
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Electrical Connection and Signal Integrity
- Power Delivery: The pins or solder balls supply power to the chip (e.g., high current for CPUs).
- Signal Transmission: High-frequency signals require impedance control (e.g., microbumps in Flip-Chip packages reduce path length, ensuring faster and more efficient signal transmission).
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Miniaturization and Integration
- High-Density Interconnects: Advanced packaging technologies (e.g., Fan-Out for Apple A-series chips) enable smaller sizes with more I/O connections.
- Heterogeneous Integration: Different functional chips (e.g., CPU + memory) can be integrated within a single package, enhancing functionality and reducing space.
- 3D Stacking: Technologies like HBM (High Bandwidth Memory) use TSV (Through-Silicon Vias) for vertical stacking, improving performance while reducing the overall size.
