In advanced semiconductor packaging and surface mount technology (SMT) assembly, Ball Grid Array (BGA) components are increasingly subjected to multiple reflow cycles. This is common in complex assemblies involving stacked dies, multi-c...
When a new IC package or board design enters NPI, you are under pressure from all sides: design freezes, schedule milestones, yield targets, and cost control. One of the most effective ways to avoid painful revisions later is to get you...
In high-density IC packaging, most engineers spend a lot of time selecting chips, substrates, and underfill. But in many failure analyses, the root cause is finally traced back to a much smaller component: the BGA solder balls. These...
Switching to spring columns is already a major technical decision.Choosing where to buy them is just as critical. For many OEMs and EMS providers, China is now a natural place to look for suppliers. But spring columns are not a simpl...
Once you decide to use CCGA spring columns, the next big question is: “What exactly should we put in the drawing and RFQ so suppliers can quote properly and we can pass reliability qualification?” If your specification is too va...
If you work on high-reliability hardware, you’ve probably seen something like this: X-ray shows cracked joints at the corners of a large ceramic package Boards pass qualification in the lab, but fail after some months in the fiel...
