A wafer is a thin, round silicon slice (similar to the "pizza crust") and serves as the "raw material substrate" for chip manufacturing. It is made from high-purity single-crystal silicon.
A chip (or die) is an individual circuit unit processed on a wafer through a series of complex steps (similar to "pizza slices"). Each chip contains a complete set of electronic components (transistors, resistors, etc.) and, once cut and packaged, becomes a processor, memory, or other electronic device component.
Chip packaging is a crucial step in semiconductor manufacturing. It involves cutting and separating the chip (die) from the wafer, then enclosing it in a protective shell using specific processes. The pad on the die is then connected electrically to the substrate and PCB.
Wafer and magnified grains under microscope：
Ensure stable operation of the chip in complex environments while providing an interface for signal transmission to external systems.
Basic Structure:
- Chip (Die): The core functional unit, cut from the wafer, containing the integrated circuit.
- Packaging Substrate: Supports the chip and provides electrical connections (e.g., wire bonding, flip-chip bonding).
- Wire: Creates the electrical connection between the chip and the packaging substrate.
- Encapsulation Material (Mold): Typically epoxy resin or ceramics that protect the chip from physical and chemical damage.
- Pins/Solder Balls: For example, solder balls in BGA (Ball Grid Array) packages connect the chip to the PCB.
