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    Reliable materials for high-yield packaging

    Luoyang Qiacai Industrial Co., Ltd.‌ is a ‌National High-Tech Enterprise‌ integrated with R&D, production, sales, and technical services. Guided by a corporate culture of ‌Focus and Execution‌, the company concentrates on the R&D and manufacturing of semiconductor materials, dedicated to ‌accelerating the localization of critical chip foundational materials‌.

    Leveraging robust R&D capabilities, Luoyang Qiacai provides customers in the electronic packaging and assembly welding sector with ‌comprehensive solutions‌, backed by ‌first-class products and services‌.

    ‌Main Products:‌ BGA Solder Balls, Copper Core Solder Balls, CCGA Solder Columns, Solder Paste, Solder Flux, Solder Preforms, Solder Mask, etc.

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    BGA & CCGA Customization

    Tailored ball diameters, alloy systems (SAC305/Sn63Pb37), and specialized surface finishes to match your specific assembly and thermal reliability requirements.

    Reliable CCGA & Copper-Core Supply

    As a leading manufacturer in China, we provide scalable mass-production for Copper-Core Solder Balls and CCGA solder columns to secure your program’s supply chain.

    Advanced Oxidation Control

    Stringent surface treatment ensures stable brightness and superior oxidation resistance, significantly improving wetting behavior and extending shelf life.

    Mass Production & Fast Lead Times

    Equipped with multiple automated high-throughput lines, we guarantee stable lead times and consistent quality for high-volume international orders.

    Certified Shear & Pull Strength

    Our interconnects deliver consistent mechanical strength and fatigue resistance, ensuring process stability in harsh environment electronics.

    Patented Interconnect Technology

    Leveraging a robust patent portfolio in core manufacturing processes, we ensure industry-leading precision and consistent manufacturing quality.

    Semiconductor Materials for Packaging & Assembly

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    Trusted by Global Customers Since 2009

    Talk to an Application Engineer

    • Chief R&D Engineer

      Ph.D., Professor, Expert in Advanced Electronic Interconnection Materials, Ph.D. Supervisor

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    • Project Leader

      Former Senior Engineer at Huawei, Gold Medal Lecturer, Overseas Project CTO

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    High-Resolution Transmission Electron Microscope (JEM-2100)
    Testing & Analysis

    We work with academic and industry partners to support materials characterization and failure analysis. Our lab resources cover routine inspection and project-based testing, helping customers verify surface quality, composition consistency and process suitability.

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    Solder Ball Manufacturing Process

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    Latest Updates in Semiconductor Materials

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