Request a Quote | BGA & Copper-Core Solder Balls — Alloys, Sizes, Packaging, Lead Time

Tell us what you need — we’ll respond with a precise, line-item quotation. QiaCai Industrial focuses on BGA solder balls and copper-core solder balls for semiconductor packaging and electronics assembly. We support engineering samples, pilot runs, and mass production with full documentation and batch traceability.

What to include in your RFQ

• Alloy / Construction: SAC305, Sn63/Pb37, Sn-Ag-Bi, copper-core, or other specified grades; note any low-alpha requirement.
• Diameter & Tolerance: nominal size (e.g., 0.20 / 0.30 / 0.50 mm), acceptable tolerance window, requested size-distribution/Cpk.
• Sphericity & Surface O₂: your roundness/sphericity criterion and oxygen limit (if required).
• Packaging Format: waffle tray, tape & reel (reel diameter and pocket pitch), or bottle/vial.
• Quantity & Lead Time Target: sample lot or production lot, preferred ship date, Incoterms/destination.
• Application & Process Notes: automotive / server / industrial; reflow peak/soak, flux type, reballing or new attach, multi-reflow requirement.
• Documentation & Compliance: COA, TDS, MSDS/SDS; RoHS/REACH statements; labeling and traceability level.

What you’ll receive: a line-item quote listing alloy/size, packaging, price breaks/MOQs, lead time, and the document pack supplied with shipment. Engineering support is available during evaluation and build.

Suggested CTAs: “Upload RFQ / BOM” · “Talk to Sales” · “Get Lead Time”

Get Samples & Specs | Waffle Tray / Tape & Reel / Bottle, MOQ & Delivery Inside

Validate in your process before scaling. Evaluation samples are produced under the same controls used for mass production and ship with complete documentation.

Available product families

• BGA solder balls — diameter distribution, sphericity, and surface oxidation control documented per lot.
• Copper-core solder balls — preferred for multi-reflow robustness, reduced collapse, improved thermal/electrical pathing, and better warpage control.
• CCGA / column interconnects (on request) — for high I/O packages or applications with CTE mismatch and shock/vibration exposure.

Packaging options for samples

• Waffle trays — precise pocketing and gentle handling for lab and pre-production trials.
• Tape & reel — ready for automated pick-and-place; specify reel size and pocket geometry.
• Bottle/Vial — convenient for reball kits and small-lot experiments.

What’s included with your sample

• COA: composition, size-distribution data, sphericity/visual checks, and O₂ metrics if requested.
• TDS: handling/storage guidance and recommended reflow window.
• MSDS/SDS and RoHS/REACH statements on request.
• Lot/Batch ID for full traceability from sampling through volume production.

Typical flow: submit request → confirm alloy/size availability and sample lead time → ship with documentation → technical feedback loop to lock the final production spec.

Suggested CTAs: “Request Samples” · “Download Specs” · “Share Reflow Profile”

Quality & Compliance | COA/MSDS/TDS, RoHS/REACH, Traceable Batches

Our quality system is built on three pillars: material chemistry, geometry control, and clean surface condition — the variables most correlated with interconnect yield and reliability in BGA attach and reball.

What we control and report

• Alloy chemistry — per-lot verification with composition reported on the COA.
• Diameter & distribution — inspection against your tolerance window; micro-BGA/CSP sizes supported when specified.
• Sphericity / roundness — metrology and visual controls to reduce opens/bridges during attach.
• Surface oxidation & cleanliness — storage/handling guidance in the TDS; O₂ metrics available when required.
• Packaging integrity — ESD-safe trays, reels, or bottles matched to your placement method to minimize handling defects.
• Batch traceability — labels link manufacturing lot, inspection records, and downstream builds.

Compliance & documentation

• COA / TDS / MSDS (SDS) supplied with shipments or upon request.
• RoHS/REACH declarations available for applicable products.
• Support for low-alpha specifications and copper-core structures for multi-reflow reliability.

Application Notes & Selection Guidance

• If your build involves multiple reflow cycles, high board warpage risk, or tight standoff control, copper-core spheres are often specified to reduce collapse and stabilize interconnect geometry.
• For AI/server and storage applications where soft-error rates are critical, specify low-alpha spheres and include the target level in your RFQ.
• In automotive and industrial controls, always state the expected thermal cycling range (e.g., −40 to 125 °C) and any vibration/shock exposure so the recommended product family and packaging can be aligned.

Handling & Process Considerations

• Store spheres per TDS (sealed, controlled humidity/temperature); observe shelf-life.
• Match flux type and reflow window to the alloy; avoid excessive soak that drives oxidation or intermetallic overgrowth.
• Confirm pocket/reel specs before tape-and-reel to ensure pick-and-place stability.
• For reballing, standardize stencil thickness, flux volume, and placement pressure; verify sphericity and size distribution against incoming QC before build.